Li, Er Ping : rechercher sur Z-Library

Le plus grand référentiel d'articles scientifiques au monde. 70,000,000+ d'articles gratuitement.

Don't use scam websites

Livres
Articles (500+)
Les plus populaires
Liste
- Liste
- Tableau

1

Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects

Er-Ping Li, Xing-Chang Wei, Cangellaris, A.C., En-Xiao Liu, Yao-Jiang Zhang, D'Amore, M., Joungho Kim, Sudo, T.

Journal:

IEEE Transactions on Electromagnetic Compatibility

Année:

2010

Langue:

english

Fichier:

PDF, 1.26 MB

english, 2010

2

A Unique Extraction of Metamaterial Parameters Based on Kramers–Kronig Relationship

Szabó, Z., Gi-Ho Park, Hedge, R., Er-Ping Li

Journal:

IEEE Transactions on Microwave Theory and Techniques

Année:

2010

Langue:

english

Fichier:

PDF, 1.31 MB

english, 2010

3

[IEEE 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - Suntec City, Singapore (2018.5.14-2018.5.18)] 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - An integrated UHF/UWB tag antenna with radome for indoor positioning system

Li, Da, Shen, Zhong-Xiang, Li, Er-Ping

Année:

2018

Langue:

english

Fichier:

PDF, 1014 KB

english, 2018

4

Hybrid Microstrip T-Stub/Defected Ground Structure Cell for Electromagnetic Interference Bandpass Filter Design

Xun Luo, Jian-Guo Ma, Er-Ping Li, Kaixue Ma

Journal:

IEEE Transactions on Electromagnetic Compatibility

Année:

2011

Langue:

english

Fichier:

PDF, 1.40 MB

english, 2011

5

[IEEE 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - Suntec City, Singapore (2018.5.14-2018.5.18)] 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - Modeling and measurement of a common-mode filter based on the 3-D transmission line structure

Li, Yong-Sheng, Swaminathan, Madhavan, Li, Er-Ping

Année:

2018

Langue:

english

Fichier:

PDF, 155 KB

english, 2018

6

[IEEE 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - Suntec City, Singapore (2018.5.14-2018.5.18)] 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - Analysis and experimental validation of power distribution network with multi-slots parallel-plane structure

Li, Yan, Cao, Wen-Yuan, Zuo, Pan-Pan, Gao, Zhi-Yi, Zheng, Hong-Xing, Li, Er-Ping

Année:

2018

Langue:

english

Fichier:

PDF, 1.25 MB

english, 2018

7

[IEEE 2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) - Hangzhou, China (2019.10.21-2019.10.23)] 2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) - A Novel Frequency Selective Surface Applied for EMI Suppression in Integrated Circuit Package

Zuo, Panpan, Jin, Hang, Li, Tianwu, Li, Er-Ping

Année:

2019

Fichier:

PDF, 228 KB

2019

8

Systematic Microwave Network Analysis for Multilayer Printed Circuit Boards With Vias and Decoupling Capacitors

Yao-Jiang Zhang, Zaw Zaw Oo, Xing-Chang Wei, En-Xiao Liu, Jun Fan, Er-Ping Li

Journal:

IEEE Transactions on Electromagnetic Compatibility

Année:

2010

Langue:

english

Fichier:

PDF, 989 KB

english, 2010

9

A coupled efficient and systematic full-wave time-domain macromodeling and circuit Simulation method for signal integrity analysis of high-speed interconnects

Er-Ping Li, En-Xiao Liu, Le-Wei Li, Mook-Seng Leong

Journal:

IEEE Transactions on Advanced Packaging

Année:

2004

Langue:

english

Fichier:

PDF, 409 KB

english, 2004

10

Enhancing the Reception of Propagating Surface Plasmons Using a Nanoantenna

Mingxia Gu, Ping Bai, Er-Ping Li

Journal:

IEEE Photonics Technology Letters

Année:

2010

Langue:

english

Fichier:

PDF, 203 KB

english, 2010

11

Design of Subwavelength CMOS Compatible Plasmonic Photodetector for Nano-Electronic-Photonic Integrated Circuits

Mingxia Gu, Ping Bai, Hong Son Chu, Er-Ping Li

Journal:

IEEE Photonics Technology Letters

Année:

2012

Langue:

english

Fichier:

PDF, 562 KB

english, 2012

12

[IEEE 2012 International Symposium on Electromagnetic Compatibility - EMC EUROPE - Rome, Italy (2012.09.17-2012.09.21)] International Symposium on Electromagnetic Compatibility - EMC EUROPE - Distributed decoupling analysis on PG planes for PDN design

Luo, Guang-Xiao, Cui, Xiang, Wei, Xing-Chang, Li, Er-Ping

Année:

2012

Langue:

english

Fichier:

PDF, 817 KB

english, 2012

13

Electrical Modeling and Design for 3D System Integration (3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC) || Systematic Microwave Network Analysis for 3D Integrated Systems

Année:

2012

Langue:

english

Fichier:

PDF, 1.23 MB

english, 2012

14

Stable Narrow Linewidth 689 nm Diode Laser for the Second Stage Cooling and Trapping of Strontium Atoms

Ye, Li, Yi-Ge, Lin, Yang, Zhao, Qiang, Wang, Shao-Kai, Wang, Tao, Yang, Jian-Ping, Cao, Tian-Chu, Li, Zhan-Jun, Fang, Er-Jun, Zang

Journal:

Chinese Physics Letters

Année:

2010

Langue:

english

Fichier:

PDF, 594 KB

english, 2010

15

[IEEE 2010 IEEE International Symposium on Electromagnetic Compatibility - EMC 2010 - Fort Lauderdale, FL (2010.07.25-2010.07.30)] 2010 IEEE International Symposium on Electromagnetic Compatibility - Efficient signal and power integrity analysis by using modal decomposition and integral equations

Xing-Chang Wei,, Er-Ping Li,, En-Xiao Liu,

Année:

2010

Langue:

english

Fichier:

PDF, 490 KB

english, 2010

16

[IEEE 2007 IEEE International Symposium on Electromagnetic Compatibility - Honolulu, HI, USA (2007.07.9-2007.07.13)] 2007 IEEE International Symposium on Electromagnetic Compatibility - The Effects of Signal Trace's Termination on Ground Bounce and Common-Mode Radiation

Chua, Eng-Kee, Li, Er-Ping, See, Kye-Yak, Chang, Weng-Yew

Année:

2007

Langue:

english

Fichier:

PDF, 223 KB

english, 2007

17

Modal Analysis of Microstrip Lines Using Singular Value Decomposition Analysis of FDTD Simulations

Ahmed, Shahid, Li, Er-Ping

Journal:

IEEE Transactions on Electromagnetic Compatibility

Année:

2008

Langue:

english

Fichier:

PDF, 360 KB

english, 2008

18

[IEEE 2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC) - Taipei, Taiwan (2015.5.26-2015.5.29)] 2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC) - An asymmetric spiral-shaped DGS optimized by genetic algorithm for wideband common-mode suppression

Yong Sheng Li,, Xing Chang Wei,, Er Ping Li,

Année:

2015

Langue:

english

Fichier:

PDF, 561 KB

english, 2015

19

[IEEE 2004 International Symposium on Electromagnetic Compatibility - Silicon Valley, CA, USA (9-13 Aug. 2004)] 2004 International Symposium on Electromagnetic Compatibility (IEEE Cat. No.04CH37559) - Analysis on the effectiveness of printed circuit board edge termination using discrete components instead of implementing the 20-H rule

Montrose, M.I., Liu Enxiao,, Er-Ping Li,

Année:

2004

Langue:

english

Fichier:

PDF, 404 KB

english, 2004

20

[IEEE 2004 International Symposium on Electromagnetic Compatibility - Silicon Valley, CA, USA (9-13 Aug. 2004)] 2004 International Symposium on Electromagnetic Compatibility (IEEE Cat. No.04CH37559) - Analysis on the effectiveness of high speed printed circuit board edge radiated emissions based on stimulus source location

Montrose, M.I., Jin Hong-Fang,, Er-Ping Li,

Année:

2004

Langue:

english

Fichier:

PDF, 393 KB

english, 2004

21

Integral Equation Technique for the Simulation of Signal Integrity and Power Integrity

Wei, Xing-Chang, Yang, De-Cao, Li, Er-Ping

Journal:

Année:

2011

Langue:

english

Fichier:

PDF, 2.28 MB

english, 2011

22

Electromagnetic Characteristics of Multiport TSVs Using L-2L De-Embedding Method and Shielding TSVs

Li, Yong-Sheng, Li, Yan, Min, Qiu, Wu, Ke, Liu, En-Xiao, Hao, Ran, Chen, Hong-Sheng, Zhuo, Cheng, Yin, Wen-Yan, Wang, Zhe-Yao, Yu, Hui-Chun, Li, Er-Ping

Journal:

IEEE Transactions on Electromagnetic Compatibility

Année:

2017

Langue:

english

Fichier:

PDF, 1.42 MB

english, 2017

23

[IEEE 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - Suntec City, Singapore (2018.5.14-2018.5.18)] 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - A novel heatsink with mushroom-type EBG structure for EMI radiation suppression

Jin, Hang, Zhang, Le, Yang, Xiao-Li, Cheng, Ping, Li, Er-Ping, Zhang, Yao-Jiang

Année:

2018

Langue:

english

Fichier:

PDF, 408 KB

english, 2018

24

[IEEE 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - Suntec City, Singapore (2018.5.14-2018.5.18)] 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - EMI prediction of packages by deep neural network

Jin, Hang, Ma, Hanzhi, Li, Er-Ping

Année:

2018

Langue:

english

Fichier:

PDF, 146 KB

english, 2018

25

[IEEE 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - Suntec City, Singapore (2018.5.14-2018.5.18)] 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - Electrical-thermal co-simulation for through silicon via and active tier in 3-D IC

Min, Qiu, Zhou, Shi-Yun, Zhuo, Cheng, Jin, Jian-Ming, Li, Er-Ping

Année:

2018

Langue:

english

Fichier:

PDF, 144 KB

english, 2018

26

Enhanced Photoresponse of Indium-Doped Tin Disulfide Nanosheets

Yuan, Shuo, Fan, Chao, Tian, He, Zhang, Yonghui, Zhang, Zi-Hui, Zhong, Mianzeng, Liu, Hongfei, Wang, Mengjun, Li, Er Ping

Journal:

ACS Applied Materials & Interfaces

Année:

2019

Langue:

english

Fichier:

PDF, 11.30 MB

english, 2019

27

Enhanced Photoresponse of Indium-Doped Tin Disulfide Nanosheets

Yuan, Shuo, Fan, Chao, Tian, He, Zhang, Yonghui, Zhang, Zi-Hui, Zhong, Mianzeng, Liu, Hongfei, Wang, Mengjun, Li, Er Ping

Journal:

ACS Applied Materials & Interfaces

Année:

2019

Fichier:

PDF, 11.30 MB

2019

28

Microstructure, mechanical properties and fracture behavior of a new WE43 alloy

Jia, Gui-Long, Wang, Li-Ping, Feng, Yi-Cheng, Guo, Er-Jun, Chen, Yan-Hong, Wang, Chang-Liang

Journal:

Année:

2020

Fichier:

PDF, 2.36 MB

2020

29

Evapotranspiration of Caragana korshinskii communities in a revegetated desert area: Tengger Desert, China

Xin-Ping Wang, Constance M. Brown-Mitic, Er-Si Kang, Jing-Guang Zhang, Xin-Rong Li

Journal:

Hydrological Processes

Année:

2004

Langue:

english

Fichier:

PDF, 368 KB

english, 2004

30

Thermal distribution calculations for block level placement in embedded systems

Rajendra M. Patrikar, K. Murali, Li Er Ping

Journal:

Microelectronics Reliability

Année:

2004

Langue:

english

Fichier:

PDF, 366 KB

english, 2004

31

Syntheses of molecular wires containing redox center: Reversible redox property and good energy level matching with Au electrode

Er Jing Wang, Cheng Liang Wang, Qing Meng, Hong Xiang Li, Wen Ping Hu, Dao Ben Zhu

Journal:

Chinese Chemical Letters

Année:

2008

Langue:

english

Fichier:

PDF, 383 KB

english, 2008

32

Establishment of BMD reference databases for the diagnosis and evaluation of osteoporosis in central southern Chinese men

Xian-Ping Wu, Yan-Li Hou, Hong Zhang, Peng-Fei Shan, Qin Zhao, Xing-Zhi Cao, Ru-Chun Dai, Xiang-Hang Luo, Er-Yuan Liao

Journal:

Journal of Bone and Mineral Metabolism

Année:

2008

Langue:

english

Fichier:

PDF, 434 KB

english, 2008

33

Apelin suppresses apoptosis of human osteoblasts

Hui Xie, Ling-Qing Yuan, Xiang-Hang Luo, Jiao Huang, Rong-Rong Cui, Li-Juan Guo, Hou-De Zhou, Xian-Ping Wu, Er-Yuan Liao

Journal:

Année:

2007

Langue:

english

Fichier:

PDF, 585 KB

english, 2007

34

Hybridization of the Scattering Matrix Method and Modal Decomposition for Analysis of Signal Traces in a Power Distribution Network

Oo, Zaw Zaw, Li, Er-Ping, Wei, Xing-Chang, Liu, En-Xiao, Zhang, Yao-Jiang, Li, Le-Wei Joshua

Journal:

IEEE Transactions on Electromagnetic Compatibility

Année:

2009

Langue:

english

Fichier:

PDF, 535 KB

english, 2009

35

Compact and efficient coupler to interface hybrid dielectric-loaded plasmonic waveguide with silicon photonic slab waveguide

Rakesh G. Mote, Hong-Son Chu, Ping Bai, Er-Ping Li

Journal:

Optics Communications

Année:

2012

Langue:

english

Fichier:

PDF, 737 KB

english, 2012

36

Confocal Microwave Imaging for Breast Cancer Detection: Delay-Multiply-and-Sum Image Reconstruction Algorithm

Hooi Been Lim, Nguyen Thi Tuyet Nhung, Er-Ping Li, Nguyen Duc Thang

Journal:

IEEE Transactions on Biomedical Engineering

Année:

2008

Langue:

english

Fichier:

PDF, 553 KB

english, 2008

37

A New Hybrid Field-Circuit Approach to Model the Power–Ground Planes With Narrow Slots

Guo-Ping Zou, Er-Ping Li, Xing-Chang Wei, Guang-Xiao Luo, Xiang Cui

Journal:

IEEE Transactions on Electromagnetic Compatibility

Année:

2010

Langue:

english

Fichier:

PDF, 429 KB

english, 2010

38

Modeling of the Simultaneous Switching Noise in High Speed Electronic Circuit with the Integral Equation Method and Vector Fitting Method

Guo-Ping Zou, Xing-Chang Wei, Er-Ping Li, Xiang Cui, Wei-Dong Zhang

Journal:

IEEE Transactions on Magnetics

Année:

2011

Langue:

english

Fichier:

PDF, 537 KB

english, 2011

39

Modeling and simulation of active plasmonics with the FDTD method by using solid state and Lorentz–Drude dispersive model

Ahmed, Iftikhar, Khoo, Eng Huat, Kurniawan, Oka, Li, Er Ping

Journal:

Journal of the Optical Society of America B

Année:

2011

Langue:

english

Fichier:

PDF, 814 KB

english, 2011

40

Plasmonic wave plate based on subwavelength nanoslits

Khoo, Eng Huat, Li, Er Ping, Crozier, Kenneth B.

Journal:

Année:

2011

Langue:

english

Fichier:

PDF, 393 KB

english, 2011

41

[IEEE 2012 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC) - Singapore, Singapore (2012.05.21-2012.05.24)] 2012 Asia-Pacific Symposium on Electromagnetic Compatibility - Time domain modeling: From nano-electronics to nano-photonics

Ahmed, Iftikhar, Li, Er-Ping

Année:

2012

Langue:

english

Fichier:

PDF, 222 KB

english, 2012

42

Authors' Reply to “Comments on Unique Extraction of Metamaterial Parameters Based on Kramers–Kronig Relationship”

Szabo, Z., Gi-Ho Park,, Hedge, R., Er Ping Li,

Journal:

IEEE Transactions on Microwave Theory and Techniques

Année:

2012

Langue:

english

Fichier:

PDF, 515 KB

english, 2012

43

[IEEE 17th International Zurich Symposium on Electromagnetic Compatibility - Singapore (2006.02.27-2006.03.3)] 2006 17th International Zurich Symposium on Electromagnetic Compatibility - Extraction of circuit parameters for transmission lines by compact 2D FDFD method

En-Xiao Liu,, Er-Ping Li,, Le-Wei Li,

Année:

2006

Langue:

english

Fichier:

PDF, 457 KB

english, 2006

44

An Intervention Study of Reproductive Tract Infections among Married Women of Reproductive Age in Shanghai

Zong-min JIANG, Yu-yan LI, Jun-qing WU, Wen-ying LI, Zeng-yu WEN, Er-sheng GAO, Xiao-ping ZHOU, Ben-cheng ZHOU

Journal:

Journal of Reproduction and Contraception

Année:

2007

Langue:

english

Fichier:

PDF, 122 KB

english, 2007

45

[IEEE 2012 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC) - Singapore, Singapore (2012.05.21-2012.05.24)] 2012 Asia-Pacific Symposium on Electromagnetic Compatibility - Systematic analysis for static and dynamic drops in power supply grids of 3-D integrated circuits

Oo, Zaw Zaw, Liu, En-Xiao, Cubillo, Joseph Romen, Li, Er-Ping

Année:

2012

Langue:

english

Fichier:

PDF, 1.05 MB

english, 2012

46

Cascaded Microwave Network Approach for Power and Signal Integrity Analysis of Multilayer Electronic Packages

Zaw Zaw Oo, En-Xiao Liu, Xing Chang Wei, Yaojiang Zhang, Er-Ping Li

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2011

Langue:

english

Fichier:

PDF, 974 KB

english, 2011

47

Electrical Modeling and Design for 3D System Integration (3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC) || Introduction

Année:

2012

Langue:

english

Fichier:

PDF, 277 KB

english, 2012

48

[IEEE 17th International Zurich Symposium on Electromagnetic Compatibility - Singapore (2006.02.27-2006.03.3)] 2006 17th International Zurich Symposium on Electromagnetic Compatibility - An efficient approach for the power/ground plane equivalent circuit extraction

Zhi Hong Liu,, Kye Yak See,, Er Ping Li,, Eng Kee Chua,

Année:

2006

Langue:

english

Fichier:

PDF, 354 KB

english, 2006

49

[IEEE 2012 IEEE International Symposium on Electromagnetic Compatibility - EMC 2012 - Pittsburgh, PA, USA (2012.08.6-2012.08.10)] 2012 IEEE International Symposium on Electromagnetic Compatibility - Far-field prediction from amplitude-only near-field measurements using equivalent electric currents

Zhao, Wei-Jiang, Park, Hark Byeong, Tan, Mark, Park, Hyun Ho, Liu, En-Xiao, Song, Eakhwan, Li, Er-Ping

Année:

2012

Langue:

english

Fichier:

PDF, 610 KB

english, 2012

50

Electrical Modeling and Design for 3D System Integration (3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC) || Supplemental Images

Année:

2012

Langue:

english

Fichier:

PDF, 388 KB

english, 2012